دانلود کتاب مواد مدیریت حرارتی برای بسته بندی الکترونیکی

With high thermal conductive components→interface→structural design as the main line, the frontier exploration and research of high power density thermal management materials are carried out by combining experimental characterization, theoretical analysis, modeling simulation, and application verification. It will reveal the thermophysical response characteristics under the conditions of multiple, multi-dimensional, multi-level, and multi-field coupling and establish a full-chain common theory and technology platform through design and preparation, device integration, and service evaluation. Through the micro–nano interface layer, local dense stack distribution, spatial network distribution, orientation distribution, and other composite configurations, the substrate thermal management efficiency is significantly improved. This book prepares high thermal conductive substrate materials through theoretical guidance, structural control, and process screening.